smt automatic wire bonding machine (9) Online Manufacturer
Features: Voltage: 200 VAC 1 Phase 2 Wires + GND 50/60 Hz Power: 1500 W
Application: Wire Bonder Machine
Features: Fine Pitch Capability For Advanced Packages
Application: Wire Bonder Machine
Features: Pre/Post Inspection Capable
Application: Die Bonder Machine
Features: High Placement Accuracy
Application: Die Bonder And Flip Chip Bonder
Features: Accuracy ± 10 µm @ 3s
Application: Wire Bonder Machine
Features: Accuracy ± 3 µm @ 3s
Application: Automatic High Precision Die Attach System
Features: Supports All Die Attach And Flip Chip Applications
Application: Die Bonder And Flip Chip Bonder
Features: Ultra High Precision 3D AOI
Application: AOI - Automatic Optical Inspection
Features: 5.5 μm Resolution For Ultra-High Precision Metrology-grade Inspection
Application: AOI - Automatic Optical Inspection
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