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Large SMT Cooling Buffer Machine After The Reflow Oven Process

Large SMT Cooling Buffer Machine After The Reflow Oven Process

15pcs Cooling Buffer

Pitch 30mm Cooling Buffer

Pitch 30mm SMD Assembly Machine

Place of Origin:

China

Brand Name:

INFITEK

Model Number:

BF-L-TN

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Product Details
Features:
15pcs (pitch 30mm) Or Customized
Application:
Cooling Buffer After The Reflow Oven Process
Description:
Large Cooling Buffer
Brand:
INFITEK
Model:
BF-L-TN
Warranty:
1 Year Warranty
Reliability:
For Industrial Use
Packaging:
Wooden Crate/box
Highlight:

15pcs Cooling Buffer

,

Pitch 30mm Cooling Buffer

,

Pitch 30mm SMD Assembly Machine

Payment & Shipping Terms
Minimum Order Quantity
1 unit
Packaging Details
crate
Payment Terms
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Product Description

Large SMT Cooling Buffer Machine After The Reflow Oven Process

 

Large Cooling Buffer, Cooling buffer after the Reflow Oven Process, SMT Cooling Buffer Machine for Heavy PCB and PCBA

 

INFITEK Large Cooling Buffer is a machine used as a cooling buffer after the Reflow Oven process. The SMT Cooling Buffer Machine is designed for the smooth transmission of heavy PCBA. INFITEK Large Cooling Buffer has a fast cooling effect and is designed to be capable of providing fast, smooth, and accurate retrieval and positioning. With a touch screen controller for easy operation and a fully enclosed design to ensure operational safety. INFITEK Large Cooling Buffer uses durable rollers for transmission (no need to replace belts). FIFO, UFO, and PASS can be set. 

 

Features:

  • Touch screen controller, easy to operate
  • The fully enclosed design ensures operational safety level
  • Use durable rollers for transmission (no need to replace belts)
  • Three modes: FIFO, UFO, PASS
  • Parallel and smooth width adjustment (ball screw)
  • Fast, smooth, and accurate retrieval and positioning
  • Fast cooling effect
  • Smooth transmission of heavy PCBA

 

TECHNICAL PARAMETERS
Description This machine is used as a cooling buffer after the reflow oven.
Cycle time About 10s
PCB capacity 15pcs (pitch 30mm) or customized
Power supply AC1P110V/220V
Power Max.3000V
Tran sport height 900±20mm(0r customized)
Transport direction From left to right or right to left
SPECIFICATIONS
Model BF-L-TN
Dimension (L*W*H MM) 1500*1495*1760
PCB size (MM) 150*150-1200*350
Weight (KG) 300

 

 

Large SMT Cooling Buffer Machine After The Reflow Oven Process 0

 

 

 

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