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450W BGA Board SMT Assembly Line BGA Loading And Unloading Machine

450W BGA Board SMT Assembly Line BGA Loading And Unloading Machine

BGA Board SMT Assembly Line

450W SMT Assembly Line

BGA Loading And Unloading Machine

Place of Origin:

China

Brand Name:

INFINITE™

Model Number:

BLD-600A, BUL-600A

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Product Details
Features:
Magazine Storage Method, With Automatic Feeding Function.
Application:
BGA Board Feeding Operation In The Semi Conductor Production Line
Description:
BGA Loading And Unloading Machine
Brand:
INFINITE™
Model:
BLD-600A, BUL-600A
Warranty:
1 Year Warranty
Reliability:
For Industrial Use
Packaging:
Wooden Crate/box
Highlight:

BGA Board SMT Assembly Line

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450W SMT Assembly Line

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BGA Loading And Unloading Machine

Payment & Shipping Terms
Minimum Order Quantity
1 unit
Packaging Details
crate
Payment Terms
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Product Description

450W BGA Board SMT Assembly Line BGA Loading And Unloading Machine

 

BGA Loading And Unloading Machine BGA Board Feeding Operation In The Semiconductor Production Line

 

INFINITE™ BGA Loading and Unloading Machine is a type of production equipment used for semiconductor packaging and testing, washing the front end of the line body, transferring the BGA board to the lower computer equipment through magazine storage with automatic feeding function. This BGA loading and unloading equipment is a required machine for BGA board feeding operation in the semiconductor production line. INFINITE™ BGA Loading and Unloading Machine adopts PLC control and an easy-to-operate touch screen control. Equipped by a servo motor for lifting and translation, lifting and transfer spacing can be set arbitrarily. INFINITE™ BGA Loading and Unloading Machine use a stepping motor as controller and the frame change method adopts the platform multi-frame storage method, with single-frame feeding and multiple-frame simultaneous feeding functions. Mechanical clamping type bin positioning method, which can adjust different size bins arbitrarily. Equipped with standard SMEMA communication port, which can communicate with other automation equipment.

 

Features:

  • Mainly used for semiconductor packaging and testing, washing the front end of the line body, transferring the BGA board to the lower computer equipment through the magazine storage method, with automatic feeding function. 
  • The control system adopts PLC control.
  • The operation interface adopts a touch screen.
  • The lifting and translation are controlled by a servo motor, and the lifting and transfer spacing can be set arbitrarily.
  • Stepping motor controlled
  • The frame change method adopts the platform multi-frame storage method, with single-frame feeding and multiple-frame simultaneous feeding functions.
  • Mechanical clamping type bin positioning method, which can adjust different size bins arbitrarily.
  • Equipped with standard SMEMA communication port, which can communicate with other automation equipment.

 

TECHNICAL PARAMETERS
Description This equipment is used for the BGA board feeding operation in the semiconductor production line
Time feed PCB 6.0-16 sec (or customer specified)
Power supply AC220V±10V, 50/60HZ
Power 450W
Air pressure 4-6 bar up to 10 liters per minute
Transport height 900±20mm (or customized)
Transport direction

From left to right or right to left

 

 

SPECIFICATIONS
Model Dimension PCB size Rack size Weight Circuit
(L*W*H MM) (MM) (L*W*H, MM) (KG) Board
        thickness
BLD-600A 1175*1000*1080 mm 80*50-330*120 50*80*100-300*150*400 240 Minimum
M/L/LL/XL 0.2-2.0mm
  thickness
BUL-600A 1175*1000*1080 mm 80*50-330*120 50*80*100-300*150*400 245 Minimum
M/L/LL/XL 0.2-2.0mm
  thickness

 

 

450W BGA Board SMT Assembly Line BGA Loading And Unloading Machine 0450W BGA Board SMT Assembly Line BGA Loading And Unloading Machine 1

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