Place of Origin:
China
Brand Name:
OMRON
Model Number:
VT-S530
Omron VT S530 SMT AOI Machine Automatic Optical Inspection Machine
Omron 3D AOI VT-S530, Original and Used Automatic Optical Inspection Machine
Omron VT-S530 is Industries Highest Value Full 3D-AOI System. The VT-S530 provides Full 3D-AOI capability, High performance, Highest First Pass Yield, Zero Escape, and lowest False Rejects amongst other strengths. VT-S530 series with Pre - Post Reflow configurations have been widely adopted in production lines where high value and quality control is required. VT-S530 Series uses a combination of Phase Shift and Omron’s unique color image processing technology called "color highlight ™ 3D shape reconstruction technology", providing the highest accuracy in Solder Joint Inspection called ‘SJI’. The technology available on the VT-S530 has been proven ultra-performant on the existing VT-S730-H with which it is sharing the new Image-Capture Module.
Omron 3D AOI VT-S530
Features:
Specifications:
Dimensions | 1180(W)×1640 (D)×1500(H) mm | |
Weight | Approx. 850kg | |
Power supply |
Voltage |
200 - 240VAC (single phase), voltage fluctuation range ±10% |
Normal rated power | 2.0kVA | |
Line height | 900±20mm | |
Air supply pressure | 0.3 - 0.6MPa | |
Operating temperature range | 10 - 35°C | |
Operating humidity range | 35 - 80%RH (Non-condensing) | |
Image signal input block |
Imaging system | 12M pixel camera |
Inspection principle | 3D reconstruction through color highlight and phase shift technology | |
Image resolution | 10μm/15μm | |
FOV |
10μ: 40×30mm | |
15μ: 60×45mm | ||
Functional specifications | Supported PCB size (min.) | 50(W)×50(D)mm |
Supported PCB size (max.) |
Dual lane: 510(W)×330(D)mm | |
Single lane: 510(W)×680(D)mm | ||
Clearance | Above: 50mm; Below: 50mm | |
Height measurement range | 25mm | |
Thickness | 0.4 - 4mm | |
Inspection item |
Component height, lift, tilt, missing/wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge |
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