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Omron VT S530 SMT AOI Machine Automatic Optical Inspection Machine

Omron VT S530 SMT AOI Machine Automatic Optical Inspection Machine

VT S530 SMT AOI Machine

Omron SMT AOI Machine

VT S530 Automatic Optical Inspection Machine

Place of Origin:

China

Brand Name:

OMRON

Model Number:

VT-S530

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Request A Quote
Product Details
Features:
FOV: 10μ: 40×30mm
Application:
Automatic PCB Inspection In SMT Production Line
Machine Description:
3D Automatic Inspection Machine
Brand:
OMRON
Model:
VT-S530
Condition:
Pre-owned / Reconditioned
Functionality:
Industrial Use - SMT Assembly Line
Packaging:
Wooden Box/Crate
Lead Time:
5 To 7 Days
Payment:
TT, L/C, D/A, D/P, Western Union, MoneyGram, Paypal
Highlight:

VT S530 SMT AOI Machine

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Omron SMT AOI Machine

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VT S530 Automatic Optical Inspection Machine

Payment & Shipping Terms
Minimum Order Quantity
1 unit
Price
USD
Packaging Details
Wooden Box
Delivery Time
1 to 5 working days
Payment Terms
L/C, D/A, D/P, T/T, Western Union, MoneyGram, Paypal
Supply Ability
10 units
Product Description

Omron VT S530 SMT AOI Machine Automatic Optical Inspection Machine

 

Omron 3D AOI VT-S530, Original and Used Automatic Optical Inspection Machine

 

Omron VT-S530 is Industries Highest Value Full 3D-AOI System. The VT-S530 provides Full 3D-AOI capability, High performance, Highest First Pass Yield, Zero Escape, and lowest False Rejects amongst other strengths. VT-S530 series with Pre - Post Reflow configurations have been widely adopted in production lines where high value and quality control is required. VT-S530 Series uses a combination of Phase Shift and Omron’s unique color image processing technology called "color highlight ™ 3D shape reconstruction technology", providing the highest accuracy in Solder Joint Inspection called ‘SJI’. The technology available on the VT-S530 has been proven ultra-performant on the existing VT-S730-H with which it is sharing the new Image-Capture Module.

 

Omron 3D AOI VT-S530

  • Industries Highest Value Full 3D-AOI System
  • FOV: 10μ: 40×30mm
  • Max PCB: 510(W)×680(D)mm
  • Weight: Approx. 850kg
  • Dimensions: 1180(W)×1640 (D)×1500(H) mm

Features:

  1. Built Upon a History of Innovation and track record of High-Quality Solutions
  2. High Speed Top View 12Mpix Camera with Telecentric Lens
  3. Latest 3D Programmable DLP Projectors (25mm max Height Inspection)
  4. Omron’s Unique Color-Highlight Illumination Technology
  5. Single / Dual Lane and Pre / Post Reflow configurations
  6. Real 3D Image Technology for Component and High-Quality Solder Joint Inspection
  7. Real-time Interactive 3D data feedback to the Programmer
  8. View and edit samples of all parts on the board simultaneously (in real-time)
  9. Process histograms are created automatically for all inspection tests and components
  10. AI self-optimization tools can perform automated inspection logic and criteria changes
  11. Real defect images can be stored in the library and used to improve the tuning process
  12. Consistent and quantitative inspection tests and logic across all component types
  13. Full 3D Data Processing and realization of Industrial 4.0 Smart Factory Solution
  14. Industrial 4.0 connectivity with The Hermes Standard for Full M2M Connectivity.
  15. Omron Q-upNavi: Combine SPI, AOI, and AXI Inspection Result Data for True Root-Cause Process Analysis for Process Improvement.
  16. Omron Q-upAuto: Advanced Manufacturing Analysis Combining Q-upNavi ‘Inspection Result Data’, with ‘Manufacturing Process Data’ for High-Level Process Improvement.
  17. VT-S530 is the latest 3D-AOI technology providing versatility for the Highest Value Quality Solutions, combining Highest Capability and Speed on the market, for tomorrow's production environments.

Specifications:

 

Dimensions 1180(W)×1640 (D)×1500(H) mm
Weight Approx. 850kg

 

Power supply

 

Voltage

200 - 240VAC (single phase), voltage fluctuation range ±10%
Normal rated power 2.0kVA
Line height 900±20mm
Air supply pressure 0.3 - 0.6MPa
Operating temperature range 10 - 35°C
Operating humidity range 35 - 80%RH (Non-condensing)

 

 

Image signal input block

Imaging system 12M pixel camera
Inspection principle 3D reconstruction through color highlight and phase shift technology
Image resolution 10μm/15μm

 

FOV

10μ: 40×30mm
15μ: 60×45mm
Functional specifications Supported PCB size (min.) 50(W)×50(D)mm

 

Supported PCB size (max.)

Dual lane: 510(W)×330(D)mm
Single lane: 510(W)×680(D)mm
Clearance Above: 50mm; Below: 50mm
Height measurement range 25mm
Thickness 0.4 - 4mm

 

Inspection item

Component height, lift, tilt, missing/wrong component, wrong polarity, flipped component, OCR inspection, 2D code, component offset (X/Y/rotation), fillet (height/length, end joint width, wetting angle, side joint length), exposed land, foreign material, land error, lead offset, lead posture, lead presence, solder ball, solder bridge

 

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